Products

Liquid Chamber® 1U Heat Sink For Use with Intel Nehalem-Family CPU's in the LGA1366 Package

Pool-Boiling Passive Heat Sink Offering Unparalleled Performance and Reliability – Without the Weight

MS109AH 1U heat sink is built with Vapro’s proprietary Liquid Chamber® which is a near-uniform thermal spreader that utilizes 2-phase pool-boiling principles.
Because of the excellent heat spreading capability of the base, the heat sink delivers lower thermal resistance than almost any other solutions available in the market today.

Liquid Chamber® has very simple and elegant internal structures which all but eliminate performance and reliability problems that vapor chamber products often face.

The simple construction of the copper chamber, together with the adoption of an aluminum bracket, makes the base of the heat sink extremely light, allowing MS109AH-Cu to use copper fins and remain below 500g in the total weight of the heat sink.

The standard heat sink comes with four screws and springs. Thermal grease of choice may be pre-applied on the base upon customer’s request.

Features and Benefits

• Low thermal resistance: the near-uniform heat spreading at the base allows low thermal resistance that is difficult to achieve with other solutions.
• Covers high power: covers up to 140W without a dry-out. Performance improves at higher power.
• Reliability: the simplicity of the design affords great tolerance to extreme conditions, including freezing and thawing that cause failures in many vapor chambers.
• Orientation-free: the heat sink works in any orientation, with minimal impact on performance.
• Light weight:
  • MS109AH-Cu (copper fins): 470g
  • MS109AH-Al (aluminum fins): 306g
  • Weight figures include screws and springs
• Dependability: MS109AH products are 100% inspected and pre-tested before shipping.

SPECIFICATIONS

Physical dimensions

Thermal Resistance (Mean+3) vs Power
Ambient Temperature of 44
C, 16CFM