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When a person becomes hot, the body tries to cool it by sweating. Here, however, the bulk of the cooling is done by the evaporation of the sweat, and not by the sweat itself. This is because the act of evaporation takes away a lot of heat from the body. In fact, vaporization of water takes away more heat than just about any other naturally occurring phenomenon known.

Boiling is the most active form of vaporization. Hence, if one can boil water with the heat generated by the electronics, one will have a best cooling solution in the world - only if it were so easy. Most of today's electronics (semiconductors) would be burnt and destroyed before they reach a temperature that boils water.

Vapro's core technology solves this problem. Result of some 20 years of research, Vapro's patented microporous coating creates surface conditions ideal to initiate and amplify the boiling of water. A coated surface enables lower boiling temperature points, more active nucleation, and higher critical heat flux (saturation point) compared to uncoated solutions under the same conditions.

According to the internal lab studies, Vapro's coating can handle far more than 1,000W of power dissipated from a surface area about the size of today's CPU. Since the coating itself is mostly made of common material such as copper powder, the cost of using the technology is also very low. Combined, Vapro's thermal management solutions enable next-generation performances at today's price points.


 

 

 



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